Development and Manufacture of Printed Circuit Boards and Respective Mounting Technologies
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ASSIGNMENT STANDARD COVER PAGE for BHM3722 Sesi 2013/2014
Due Date: 07-04-2014
MISSION:
TAG LINE:
Team members name
Matriks no (Fxxxxx)
Signature
Comments
1
NUREMALINA BT AHMAD SAHRUL
HA10004
2
3
4
5
6
7
8
9
Assignment
01
-
Name
BFM3722 SMD Technology
Score
50
Assignment 1 Due Date: Monday 7th April 2014 at 12.00 pm
This is an individual assignment
Please ensure compliance to assignment SOP
CO1: Explain development and manufacture of printed circuit boards and the respective mounting technologies
CO2: Explain the assembly, soldering and testing (electrical, optical,) processes in the production of mechatronic boards
CO3: Evaluate general SMD related problems in manufacturing
PO 3
Design and Develop Solutions
This assignment evaluate the students’ ability to:
Understand the overview of SMD and its elements
Understand the SMT manufacturing processes and materials
Questions:
1. Compare the conventional through-hole mounting technology used for printed circuit assemblies versus the surface mount technology. You may answer from the financial i.e cost and technical aspects i.e BOM , processes etc
2. SMDs are constructed with different types of lead styles. Explain the different shapes and style and comment on what you understand on the lead pitch.
Question 1
Through Hole Mounting: This mounting technique involves different components which have lead wires that are led to the board through holes, hence the name. In this method, leads rely on holes in a multilayer PCB. The leads are then finally soldered to offer permanent mounting.
The technology finds usage in:-
DIP aka Dual Inline Packaging
Pin Grid Array Package
Surface Mounting: This is a relatively new mounting method worked out seeing a tremendous increase in the number of
ASSIGNMENT STANDARD COVER PAGE for BHM3722 Sesi 2013/2014
Due Date: 07-04-2014
MISSION:
TAG LINE:
Team members name
Matriks no (Fxxxxx)
Signature
Comments
1
NUREMALINA BT AHMAD SAHRUL
HA10004
2
3
4
5
6
7
8
9
Assignment
01
-
Name
BFM3722 SMD Technology
Score
50
Assignment 1 Due Date: Monday 7th April 2014 at 12.00 pm
This is an individual assignment
Please ensure compliance to assignment SOP
CO1: Explain development and manufacture of printed circuit boards and the respective mounting technologies
CO2: Explain the assembly, soldering and testing (electrical, optical,) processes in the production of mechatronic boards
CO3: Evaluate general SMD related problems in manufacturing
PO 3
Design and Develop Solutions
This assignment evaluate the students’ ability to:
Understand the overview of SMD and its elements
Understand the SMT manufacturing processes and materials
Questions:
1. Compare the conventional through-hole mounting technology used for printed circuit assemblies versus the surface mount technology. You may answer from the financial i.e cost and technical aspects i.e BOM , processes etc
2. SMDs are constructed with different types of lead styles. Explain the different shapes and style and comment on what you understand on the lead pitch.
Question 1
Through Hole Mounting: This mounting technique involves different components which have lead wires that are led to the board through holes, hence the name. In this method, leads rely on holes in a multilayer PCB. The leads are then finally soldered to offer permanent mounting.
The technology finds usage in:-
DIP aka Dual Inline Packaging
Pin Grid Array Package
Surface Mounting: This is a relatively new mounting method worked out seeing a tremendous increase in the number of