Layout design
Note: some figures are taken from Ref. B. Razavi, Design of Analog CMOS integrated circuits, Mc Graw-Hill, 2001, and MOSIS web site: http://www.mosis.org/ 1
E. Martinez-Guerrero /Taller de Diseño Físico / MDE_DESI_ITESO/Otoño 2006
Introduction to layout design
Layout consist in:
Draw geometrical objects of different layers,
Make arrays of geometrical objects,
Patterns
Make blocks of arrays for the core, interface, for the and padframe. fabrication the
Interconnect blocks and interfaces to the
“masks”
padframe,
All the layout must satisfy “design rules”
Why design rules?
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E. Martinez-Guerrero /Taller de Diseño Físico / MDE_DESI_ITESO/Otoño 2006
Layers for designs masks used by L-Edit
Default SCNA CMOS Layers
Physical layer
Name
Color
N-well
N-WELL
TAN dashed
SiN3
ACTIVE
GREEN filled
Polysilicon 1
POLY1
RED filled
Polysilicon 2
POLY2
BLACK filled
Contact to poly
POLY CONTACT
BLACK filled
P+ Ion implant
PSELECT
RED dashed
N+ Ion implant
NSELECT
TAN dashed
Contact to N+/P+ ACTIVE CONTACT
BLACK filled
Metal 1
METAL 1
BLUE filled
Metal 2
METAL 2
GREY filled
Via oxide cuts
VIA
WHITE filled
Pad contacts
OVERGLASS
Purple crosshatch
E. Martinez-Guerrero /Taller de Diseño Físico / MDE_DESI_ITESO/Otoño 2006
3
Considerations in layout of CMOS
D
G
S
Basic layout of a MOSFET
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E. Martinez-Guerrero /Taller de Diseño Físico / MDE_DESI_ITESO/Otoño 2006
Considerations in layout of CMOS
Changes in W due to tolerances in the fabrication process oxide encroachment
D
FOX
FOX
G
Drawn Width
p-substrate
S
bird’s beak
FOX
FOX gate oxide
FOX
FOX
FOX
W
DW/2
p-substrate
W
ideal real E. Martinez-Guerrero /Taller de Diseño Físico / MDE_DESI_ITESO/Otoño 2006
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Considerations in layout of CMOS
Changes in L due to tolerances in the fabrication