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Template for Preparation of Papers for IEEE Sponsored Conferences & Symposia
Frank Anderson, Sam B. Niles, Jr., and Theodore C. Donald, Member, IEEE
Abstract—These instructions give you guidelines for preparing papers for IEEE conferences. Use this document as a template if you are using Microsoft Word 6.0 or later. Otherwise, use this document as an instruction set. Instructions about final paper and figure submissions in this document are for IEEE journals; please use this document as a “template” to prepare your manuscript. For submission guidelines, follow instructions on paper submission system as well as the Conference website. Do not delete the blank line immediately above the abstract; it sets the footnote at the bottom of this column.
INTRODUCTION
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HIS document is a template for Microsoft Word versions 6.0 or later. If you are reading a paper version of this document, please download the electronic file, ieeeconf_letter.dot (for letter sized paper: 8.5” x 11”) or ieeeconf_A4.dot (for A4 sized paper: 210mm x 297mm) and save to MS Word templates directory. The template to produce your conference paper is available at www.paperplaza.net/support/support.html. To create your own document, from within MS Word, open a new document using File | New then select ieeeconf_letter.dot (for letter sized paper) or ieeeconf_A4.dot (for A4 sized paper). All instructions beyond this point are from IEEE. Instructions about final paper and figure submissions in this document are for IEEE journals; please use this document as a “template” to prepare your manuscript. For submission guidelines, follow instructions on paper submission system as well as the Conference website. If your paper is intended for a conference, please contact your conference editor concerning acceptable word processor formats for your particular conference. When you open ieeeconf_letter.doc or ieeeconf_A4.doc, select “Page Layout” from the “View” menu in the menu bar (View | Page
Template for Preparation of Papers for IEEE Sponsored Conferences & Symposia
Frank Anderson, Sam B. Niles, Jr., and Theodore C. Donald, Member, IEEE
Abstract—These instructions give you guidelines for preparing papers for IEEE conferences. Use this document as a template if you are using Microsoft Word 6.0 or later. Otherwise, use this document as an instruction set. Instructions about final paper and figure submissions in this document are for IEEE journals; please use this document as a “template” to prepare your manuscript. For submission guidelines, follow instructions on paper submission system as well as the Conference website. Do not delete the blank line immediately above the abstract; it sets the footnote at the bottom of this column.
INTRODUCTION
T
HIS document is a template for Microsoft Word versions 6.0 or later. If you are reading a paper version of this document, please download the electronic file, ieeeconf_letter.dot (for letter sized paper: 8.5” x 11”) or ieeeconf_A4.dot (for A4 sized paper: 210mm x 297mm) and save to MS Word templates directory. The template to produce your conference paper is available at www.paperplaza.net/support/support.html. To create your own document, from within MS Word, open a new document using File | New then select ieeeconf_letter.dot (for letter sized paper) or ieeeconf_A4.dot (for A4 sized paper). All instructions beyond this point are from IEEE. Instructions about final paper and figure submissions in this document are for IEEE journals; please use this document as a “template” to prepare your manuscript. For submission guidelines, follow instructions on paper submission system as well as the Conference website. If your paper is intended for a conference, please contact your conference editor concerning acceptable word processor formats for your particular conference. When you open ieeeconf_letter.doc or ieeeconf_A4.doc, select “Page Layout” from the “View” menu in the menu bar (View | Page
References: 1] G. O. YOUNG, “SYNTHETIC STRUCTURE OF INDUSTRIAL PLASTICS (BOOK STYLE WITH PAPER TITLE AND EDITOR),” IN PLASTICS, 2ND ED. VOL. 3, J. PETERS, ED. NEW YORK: MCGRAW-HILL, 1964, PP. 15–64. 2] W.-K. Chen, Linear Networks and Systems (Book style). Belmont, CA: Wadsworth, 1993, pp. 123–135. 3] H. Poor, An Introduction to Signal Detection and Estimation. New York: Springer-Verlag, 1985, ch. 4. 7] C. J. Kaufman, Rocky Mountain Research Lab., Boulder, CO, private communication, May 1995. 9] M. Young, The Techincal Writers Handbook. Mill Valley, CA: University Science, 1989. 10] J. U. Duncombe, “Infrared navigation—Part I: An assessment of feasibility (Periodical style),” IEEE Trans. Electron Devices, vol. ED-11, pp. 34–39, Jan. 1959. 12] R. W. Lucky, “Automatic equalization for digital communication,” Bell Syst. Tech. J., vol. 44, no. 4, pp. 547–588, Apr. 1965. 13] S. P. Bingulac, “On the compatibility of adaptive controllers (Published Conference Proceedings style),” in Proc. 4th Annu. Allerton Conf. Circuits and Systems Theory, New York, 1994, pp. 8–16. 14] G. R. Faulhaber, “Design of service systems with priority reservation,” in Conf. Rec. 1995 IEEE Int. Conf. Communications, pp. 3–8. 16] G. W. Juette and L. E. Zeffanella, “Radio noise currents n short sections on bundle conductors (Presented Conference Paper style),” presented at the IEEE Summer power Meeting, Dallas, TX, June 22–27, 1990, Paper 90 SM 690-0 PWRS. 18] J. Williams, “Narrow-band analyzer (Thesis or Dissertation style),” Ph.D. dissertation, Dept. Elect. Eng., Harvard Univ., Cambridge, MA, 1993. 19] N. Kawasaki, “Parametric study of thermal and chemical nonequilibrium nozzle flow,” M.S. thesis, Dept. Electron. Eng., Osaka Univ., Osaka, Japan, 1993. 20] J. P. Wilkinson, “Nonlinear resonant circuit devices (Patent style),” U.S. Patent 3 624 12, July 16, 1990. 21] IEEE Criteria for Class IE Electric Systems (Standards style), IEEE Standard 308, 1969. 23] R. E. Haskell and C. T. Case, “Transient signal propagation in lossless isotropic plasmas (Report style),” USAF Cambridge Res. Lab., Cambridge, MA Rep. ARCRL-66-234 (II), 1994, vol. 2. 24] E. E. Reber, R. L. Michell, and C. J. Carter, “Oxygen absorption in the Earth’s atmosphere,” Aerospace Corp., Los Angeles, CA, Tech. Rep. TR-0200 (420-46)-3, Nov. 1988. 25] (Handbook style) Transmission Systems for Communications, 3rd ed., Western Electric Co., Winston-Salem, NC, 1985, pp. 44–60. Motorola Semiconductor Data Manual, Motorola Semiconductor Products Inc., Phoenix, AZ, 1989.