L. J. Willett, S. K. Loyalka, and R. V. Tompson
Citation: J. Vac. Sci. Technol. A 17, 212 (1999); doi: 10.1116/1.581575
View online: http://dx.doi.org/10.1116/1.581575
View Table of Contents: http://avspublications.org/resource/1/JVTAD6/v17/i1
Published by the AVS: Science & Technology of Materials, Interfaces, and Processing
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Vapor deposition modeling for an entrenched wafer geometry
L. J. Willett, S. K. Loyalka,a) and R. V. Tompson
Nuclear Engineering Program and Particulate Systems Research Center, University of Missouri-Columbia,
Columbia, Missouri 65211
͑Received 11 February 1998; accepted 30 October 1998͒
Empirical