Tt1310 Unit 1 Reaction Paper

TCEF TouchChip Fingerprint Modules
TCEFC1/TCESC1 – FIPS 201, Large image capture area (TCS1 sensor) TCEFD1/TCESD1 – SteelCoat, Large image capture area (TCS1 sensor) TCEFD2/TCESD2– SteelCoat, Medium image capture area (TCS2 sensor) UPEK’s TouchChip Fingerprint Modules (TCEF) leverage UPEK’s widely deployed and proven fingerprint sensors and package them into a drop-in module for easy integration and fast time-to-market.

Advantages
Proven technology – UPEK fingerprint sensors have been embedded into tens of millions of devices. Easy to Integrate – Drop-in module is factory assembled and calibrated. Compact – Enables devices up to 1/10th the size of bulky optics. Low Power – Reduces power consumption for longer battery life. Low Cost – Priced
below today’s expensive AFIS optics devices. On Board Matching – Image capture, template extract/match/storage. Robust – Proven in many devices including PC’s, keyboards, smart card readers, door locks, handheld terminals and more. Algorithm compatibility – Bioscrypt/L1, BIO-key, Cogent, Innovatrics, NEC, Neurotechnology, Precise Biometrics, Sagem, Suprema and more.

Features
Digital ID Hardware Engine (TCD50) – Companion processor performs template extraction, storage and matching. FIPS 201 (Enhanced Image Mode – EIM) – The TCEFC1 utilizes the only FIPS 201 certified silicon fingerprint sensor approved by NIST and the FBI. SteelCoat – The TCEFD1 and TCEFD2 offer an additional protective coating that enhances durability for rugged environments. Integrated Bezel – Aids in finger guiding, finger detection, image enhancement, and ESD mitigation. Ingress Protection – Dust and water proof to IP 65 (requires external gasket) Flexible Interfaces – Supports USB or SPI/UART interfaces

Biometric Identity Management System

TCEF TouchChip Fingerprint Modules

High Quality Image Capture
12.8 mm

TCEFC1/TCESC1 TCEFD1/TCESD1 TCEFD2/TCESD2
TCS1CM 256 x 360 Yes TCS1SM 256 x 360 No 508 DPI 8 - bit CMOS active capacitance TCS2SN 208 x 288 No

Sensor Image Size (pixels)

18 mm
12.8 mm

18 mm

35 mm

TCEFC1 / TCESC1
(TCS1CM sensor)

FIPS 201 certified Image resolution Grayscale depth

29 mm

Sensor Technology

Image and Template Compatibility
12.8 mm

Template storage (w/UPEK algorithm) Image output format compatibility

100

80 ANSI 381, ISO 19794-4

80

18 mm

35 mm

TCEFD1/TCESD1
(TCS1SM sensor)

Minutiae format compatibility

UPEK formats/ANSI 378/ISO 19794-2 minutia support (template convertor integrated)

E cient Power Management
Power Consumption
29 mm 10.4 mm

Imaging mode Suspend mode

80mA typical 1.35mA typical

Compact Form Factor
14.4 mm 35 mm

TCEFD2/ TCESD2
(TCS2SN sensor)

Small package size Connector options USB, 6 position flex, 3.3V
TCEFC1FF011 TCEFC1FG011 TCEFC1FI011 TCESC1FF021

29 x 35 x 6 mm 1.1” x 1.4” x 0.2”

TCEFD1FF011 TCEFD1FG011 TCEFD1FI011 TCESD1FF021

TCEFD2FF011 TCEFD2FG011 TCEFD2FI011 TCESD2FF021

29 mm

USB, 6 position flex, 5.0V USB, wire header, 5.0V SPI/UART, 12 position flex, 3.3V

Flexible Options
TCEFC1 (USB) / TCESC1 (SPI/UART)
FIPS 201 certified image quality for a single finger capture device.
Rugged
Coating Coating performance IP Protection
Standard (gold) 2 Million SteelCoat (black) 4 Million SteelCoat (black) 4 Million

IP 65 (requires external gasket: TCGKT011A) 5% to 93% RH

TCEFD1 (USB) / TCESD1 (SPI/UART)
Large image capture area for optimal usability and SteelCoat protective coating for added ruggedness.

Humidity

Easy to Integrate
Interface Development Kit Supported OS’s SDK’s
USB or SPI/UART TCKDSMOD Windows XP/Vista/7, Linux, MacOS BSAPI 3.6, PTAPI 3.8

TCEFD2 (USB) / TCESD2 (SPI/UART)
Ideal for cost-sensitive applications that require touch-based authentication. SteelCoat protective coating for added ruggedness.

UPEK, Inc.
5900 Christie Ave Emeryville, CA 94608 U.S.A. Tel: [phone] Fax: [phone] www.upek.com [e-mail]

UPEK PTE LTD
55 UBI Avenue 3 #03-00 Mintwell Building Singapore 408864 Tel: [phone]
!"#$%$&"'()*+",-."'()*"/010+"234"5067-8-9:"2;.";.19