who are better students boys or girls?
IC26_CHAPTER_1_2000_2.copy Page 1 Tuesday, May 23, 2000 1:01 PM
CHAPTER 1
OVERVIEW OF IC PACKAGES
page
Package overview
1-2
Through-hole mount packages
1-4
Surface mount packages
1-5
Package type overview with lead count
1-6
IC26_CHAPTER_1_2000_2.copy Page 2 Tuesday, May 23, 2000 1:01 PM
Philips Semiconductors
Overview of IC packages
Chapter 1
PACKAGE OVERVIEW
The development of the IC package is a dynamic technology. Applications that were unattainable only a few years ago are today common place thanks in part to advances in package design. From mobile telecommunications and satellite broadcasting to aerospace and automotive applications, each imposes its own individual demands on the electronic package. To meet such a diverse range of application requirements, our IC package range encompasses over thirty different types, most of which are sub-divided into a number of outline versions. An overview of this range is shown in Fig.1, with packages classified into board mounting methods, construction form and power handling capability. The packages in these “power” categories offer a high thermal dissipation enabling IC usage in some of the most demanding application areas. Notable extensions to our range since the last publication of this book include the Ball Gate Array (BGA) packages with their high pin count, and the miniature LFBGA packages.
A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is presented in the tables on pages 1 - 6 to 1 - 8.
2000 May 10
1-2
IC26_CHAPTER_1_2000_2.copy Page 3 Tuesday, May 23, 2000 1:01 PM
Philips Semiconductors
Overview of IC packages
Chapter 1
gewidth
HCPGA
POWER
CERAMIC
CDIL
CPGA
THROUGH HOLE
PACKAGES
DIP
SDIP
SIL
PLASTIC
DBS
HDIP
RBS
RDBS
SIL
TBS
POWER
CLLCC
CWQCCN
CERAMIC
IC
PACKAGES
SURFACE MOUNT
PACKAGES
PMFP
SO
SSOP
TSSOP
VSO
DUAL
CHAPTER 1
OVERVIEW OF IC PACKAGES
page
Package overview
1-2
Through-hole mount packages
1-4
Surface mount packages
1-5
Package type overview with lead count
1-6
IC26_CHAPTER_1_2000_2.copy Page 2 Tuesday, May 23, 2000 1:01 PM
Philips Semiconductors
Overview of IC packages
Chapter 1
PACKAGE OVERVIEW
The development of the IC package is a dynamic technology. Applications that were unattainable only a few years ago are today common place thanks in part to advances in package design. From mobile telecommunications and satellite broadcasting to aerospace and automotive applications, each imposes its own individual demands on the electronic package. To meet such a diverse range of application requirements, our IC package range encompasses over thirty different types, most of which are sub-divided into a number of outline versions. An overview of this range is shown in Fig.1, with packages classified into board mounting methods, construction form and power handling capability. The packages in these “power” categories offer a high thermal dissipation enabling IC usage in some of the most demanding application areas. Notable extensions to our range since the last publication of this book include the Ball Gate Array (BGA) packages with their high pin count, and the miniature LFBGA packages.
A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is presented in the tables on pages 1 - 6 to 1 - 8.
2000 May 10
1-2
IC26_CHAPTER_1_2000_2.copy Page 3 Tuesday, May 23, 2000 1:01 PM
Philips Semiconductors
Overview of IC packages
Chapter 1
gewidth
HCPGA
POWER
CERAMIC
CDIL
CPGA
THROUGH HOLE
PACKAGES
DIP
SDIP
SIL
PLASTIC
DBS
HDIP
RBS
RDBS
SIL
TBS
POWER
CLLCC
CWQCCN
CERAMIC
IC
PACKAGES
SURFACE MOUNT
PACKAGES
PMFP
SO
SSOP
TSSOP
VSO
DUAL