Circuit Board Fabricators‚ Inc. CBF hired you to help determine why it is not able to produce the 1‚000 boards per day. 1. What type of process flow structure is CBF using? 2. Diagram the process in a manner similar to Exhibit 6.7. 3. Analyze the capacity of the process. 4. What is the impact of the losses in the process in Inspection and Final Test? 5. What recommendation would you make for a short-term solution of CBF’s problems? 6. What long-term recommendations would you make.
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Case: Circuit Board Fabricators‚ Inc. What type of process flow structure is CBF using? The company is using a batch shop process flow structure. CBF‚ Inc. bases its board fabrication process on the average job size or on its typical order. This means that the company proceeds with the manufacturing process in batches so as to meet the specific requirements per order. The typical contract that the company currently gets is 60 boards per order. However‚ due to persisting factory
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Case Study: Circuit Board Fabricators Inc. Carl Anthony Jackson Sr. University of Phoenix OSC301 Operations Management Kimberly Ford January‚ 21 2008 In this case study Circuit Board Fabricators manufactures circuit boards for several computer companies. CBF has a capacity to produce 1000 circuit boards per day‚ but CBF can not meet these objectives set by process engineers. This case study will analyze what CBF is doing wrong and how they can improve their process
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structure is CBF using? Circuit Board Fabricators Inc. uses a job shop process flow structure. The job shop process flow structure is a production of small batches of a large number of different products.The job shop process is also a flexible operation that has several activities through which work can pass. In a job shop‚ it is not necessary for all activities to be performed on all products‚ and their sequence may be different for different products.CBF‚ Inc. bases its board fabrication process on
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study is about Circuit Board Fabricators‚ Inc. which manufactures circuit boards for several companies like Apple Computer and Hewlett-Packard to name a few. Circuit Board Fabricators‚ Inc. plant was designed to produce 1000 boards per day but they cannot meet such production levels as their process engineer insists. On a good day‚ Circuit Board Fabricators‚ Inc. is able to produce around 700 boards. One will analyze and see how Circuit Board Fabricators‚ Inc. can meet the 1000 board requirements of
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Case Summary Circuit Board Fabricators‚ Inc. is a small manufacturer of circuit boards located in California. (Chase‚ Jacobs‚ and Aquilano‚ 2004) Large computer companies such as Apple and Hewlett-Packard hire Circuit Board Fabricators to "make boards for prototypes of new products." (Chase‚ et al.‚ 2004) The case study suggests that Circuit Board Fabricators has a good business plan established within the organization. CBF has implemented a largely automated process using industry standard
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Case Circuit Board Corporation Background/Introduction Circuit Board Corporation creates and manufactures printed circuit boards. The founder‚ the late Dieter Adams had started Circuit Board Corporation in 1961‚ were the computer industry was in its introductory stages. The company started by designing and manufacturing PCB’s for minicomputer companies. Maggie Adams which was Dieter Adams beloved wife was employed as a part time employee and secretary of the board to CEO after her husband died
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Circuit Board Case Study Circuit Board Fabricators‚ Inc. is a circuit board manufacturer based in California. They produce circuit boards to large organizations like Apple and Hewlett-Packard. The large computer companies hire Circuit Board Fabricators‚ Inc. (CBF) to make to circuit boards for the large companies new prototypes. CBF implements a large automated process that follows standard codes to produce these circuit boards efficiently and with above average customer service; however‚ recently
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Thermoelastic Properties of Printed Circuit Boards: Effect of Copper Trace Hu Guojun‚ Goh Kim Yong‚ Luan Jing-en‚ Lim Wee Chin and Xavier Baraton STMicroelectronics‚ 629 Lorong 4/6 Toa Payoh‚ Singapore 319521‚ Singapore Tel: +65 63897056. E-mail address: guojun.hu@st.com Abstract After encapsulation‚ thermo-mechanical deformation builds up within the electronic packages due to coefficient of thermal expansion (CTE) mismatch between the respective materials within the package as it cools to
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individual batch time that’s why they didn’t utilize the total capacity of production. 4.What is the impact of losses in the process in Inspection and Final Test ? The impact of the losses in the system is quite extensive. It is stated that 15% of the board are typically rejected during an early processing inspection along with an additional 5% rejected during the final testing. This results in a production order increase of 25%. 5.What recommendations would you make for a short-term solution to CBF’s
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