Intel Case DRAM industry analysis - lessons learned By the early 1980‚ Intel’s total share in DRAM was barely 1% and manufacturing was restricted to one fab out of Intel’s eight fab‚ where the Japanese semiconductor companies had captured nearly half of the world memory market. There are several factors that forced Intel to exit the DRAM market‚ those are the same lessons learned. 1. Intel was always the pioneer in inventing and enhancing the DRAM with respect to the price and performance‚
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Photocatalytic degradation of methylene blue using TiO2 nanoparticles Nupur Mittal Chemical Engineering‚ IIT (BHU) Varanasi. Abstract: The aim of this research is to reduce the pollution caused by methylene blue dye in waste water coming from textile industries. For this purpose‚ TiO2 nanoparticles are made as they show good photocatalytic activity in degradation of dyes into harmless products. Synthesis is done using titanium butoxide and 2-propanol. The particles formed were a little larger
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EE3501E – Power Electronics Lecture 2 Text Power Electronics ‐ A First Course Author: Ned Mohan ‐ / 2012 John Wiley and Sons 1 Lecture 1 ‐ Review • • • • • • What is Power Electronics? Applications of power electronics. Linear vs Switched power conversion. Switching‐power pole Inductors and capacitors‐basic properties. Pulse‐Width‐Modulation (PWM) 2 Linear vs Switch mode conversion 3 Switching Power‐Pole + Vin q A qA 1 vv A + vA - A Vin 0 0 t
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SUPERADHERENT HARD COATINGS BY ION BEAM ENHANCED DEPOSITION 1. COVER SHEET (see attached) 2. IDENTIFICATION & SIGNIFICANCE OF THE OPPORTUNITY The objective of this proposal is to demonstrate the feasibility of producing super adherent protective coatings at low processing temperatures using energetic ion beams in conjunction with conventional deposition techniques. This process‚ coined Ion Beam Enhanced Deposition (IBED)‚ is depicted in Figure 1 and promises a new generation of exotic coatings
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Trying to Change the Corporate Culture of a Multinational Enterprise: General Semiconductor 1. In your opinion‚ what actions taken by Ostertag stood the most chance of changing General Semiconductor’s culture? His decision to “replace nearly every member of the company’s senior management team” could have been more effective and beneficial had he only replaced those on the management team who were not upholding and enforcing the values and cultures of the company. The “team-building meeting
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EXECUTIVE SUMMARY This document highlights the principal reliability challenges associated with key semiconductor technologies and identifies the research needs to assess and control the reliability risks. Based upon the consensus of the Reliability Technical Advisory Board (RTAB)‚ the top five issues that deserve the most attention are high-k gate dielectrics‚ metal gate‚ copper/low-k interconnects‚ packaging‚ and design and test for reliability. Within high-k gate dielectrics‚ metal
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[Type the company name] | Strategy Assignment (Intel Case) | [Type the document subtitle] | | [Type the author name] | 3/28/2012 | Submitted By: Swati Agrawal Roll no:154
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Microelectronics Reliability xxx (2012) xxx–xxx Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Experiment study of dynamic looping process for thermosonic wire bonding Fuliang Wang ⇑‚ Yun Chen‚ Lei Han State Key Laboratory of High Performance Complex Manufacturing‚ Changsha 410083‚ China School of Mechanical and Electrical Engineering‚ Central South University‚ Changsha 410083‚ China a r t i c l e
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Unit-II: MOS/BiCMOS Process Technology and Integration Introduction BiCMOS = CMOS + Bipolar (BJT) structures on the same substrate. Advantanges of CMOS device: 1. Low Power 2. High digital IC density. Advantages of Bipolar transistors: 1. Ability to deliver large drive currents 2. Capability to rapidly charge heavy loads. The implementation of digital bipolar circuits with emitter-coupled logic (ECL) gates permits small logic swings and excellent noise immunity
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1. INTRODUCTION Micro electromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components. They range in size from the sub micrometer level to the millimeter level and there can be any number‚ from a few to millions‚ in a particular system. MEMS extend the fabrication techniques developed for the integrated circuit industry to add mechanical elements such as beams‚ gears‚ diaphragms‚ and springs to devices. Examples of MEMS device applications
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