EE3501E – Power Electronics Lecture 2 Text Power Electronics ‐ A First Course Author: Ned Mohan ‐ / 2012 John Wiley and Sons 1 Lecture 1 ‐ Review • • • • • • What is Power Electronics? Applications of power electronics. Linear vs Switched power conversion. Switching‐power pole Inductors and capacitors‐basic properties. Pulse‐Width‐Modulation (PWM) 2 Linear vs Switch mode conversion 3 Switching Power‐Pole + Vin q A qA 1 vv A + vA - A Vin 0 0 t
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SUPERADHERENT HARD COATINGS BY ION BEAM ENHANCED DEPOSITION 1. COVER SHEET (see attached) 2. IDENTIFICATION & SIGNIFICANCE OF THE OPPORTUNITY The objective of this proposal is to demonstrate the feasibility of producing super adherent protective coatings at low processing temperatures using energetic ion beams in conjunction with conventional deposition techniques. This process‚ coined Ion Beam Enhanced Deposition (IBED)‚ is depicted in Figure 1 and promises a new generation of exotic coatings
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Trying to Change the Corporate Culture of a Multinational Enterprise: General Semiconductor 1. In your opinion‚ what actions taken by Ostertag stood the most chance of changing General Semiconductor’s culture? His decision to “replace nearly every member of the company’s senior management team” could have been more effective and beneficial had he only replaced those on the management team who were not upholding and enforcing the values and cultures of the company. The “team-building meeting
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EXECUTIVE SUMMARY This document highlights the principal reliability challenges associated with key semiconductor technologies and identifies the research needs to assess and control the reliability risks. Based upon the consensus of the Reliability Technical Advisory Board (RTAB)‚ the top five issues that deserve the most attention are high-k gate dielectrics‚ metal gate‚ copper/low-k interconnects‚ packaging‚ and design and test for reliability. Within high-k gate dielectrics‚ metal
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[Type the company name] | Strategy Assignment (Intel Case) | [Type the document subtitle] | | [Type the author name] | 3/28/2012 | Submitted By: Swati Agrawal Roll no:154
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Microelectronics Reliability xxx (2012) xxx–xxx Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Experiment study of dynamic looping process for thermosonic wire bonding Fuliang Wang ⇑‚ Yun Chen‚ Lei Han State Key Laboratory of High Performance Complex Manufacturing‚ Changsha 410083‚ China School of Mechanical and Electrical Engineering‚ Central South University‚ Changsha 410083‚ China a r t i c l e
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Unit-II: MOS/BiCMOS Process Technology and Integration Introduction BiCMOS = CMOS + Bipolar (BJT) structures on the same substrate. Advantanges of CMOS device: 1. Low Power 2. High digital IC density. Advantages of Bipolar transistors: 1. Ability to deliver large drive currents 2. Capability to rapidly charge heavy loads. The implementation of digital bipolar circuits with emitter-coupled logic (ECL) gates permits small logic swings and excellent noise immunity
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1. INTRODUCTION Micro electromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components. They range in size from the sub micrometer level to the millimeter level and there can be any number‚ from a few to millions‚ in a particular system. MEMS extend the fabrication techniques developed for the integrated circuit industry to add mechanical elements such as beams‚ gears‚ diaphragms‚ and springs to devices. Examples of MEMS device applications
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has manufacturing‚ design and sales operations in more than 25 countries. * It has three separate business segments: (1) Semiconductor 85%. (2) Sensors & Controls 10%. (3) Educational & Productivity Solutions 5%. The Semiconductor segment accounts for the highest growth rate than its other two business segments. * It was the third-largest semiconductor company in 2004 in terms of revenue. * TI employs approximately 35‚200 people worldwide‚ with about 16‚100 in the United
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Most Admired Companies. Intel was ranked #1 in the semiconductor industry (1).” We will assess Intel by taking into account an in-depth overview within their industry from a business and financial perspective; how the internal and external environments affect Intel; and lastly‚ a detailed analysis of its stakeholders and recommendations on how they should approach short and long-term strategies. With its humble beginnings in the semiconductor industry‚ creating the first commercial microprocessor
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