ATP P1: A Case Study
The packages and services that ATP P1 performs are the following (3): TSSOP, SSOP, TQFP, MQFP, TSOP, PSOP, PSSOP, MSOP, PLCC, SOIC, PDIP, SOT/SC, CERDIP, SiP, PBGA, MicroLeadFrame, Hermetics & Specialty, Die Sales, Strip Test, Backgrind, Plating and T&R. The packages depend on the customer requirements but the general processes are the same.
The production line is divided into two parts, the Front of Line (FOL) and the End of Line (EOL). Front of line operators need to wear bunny suit as a Clean Room protocol to ensure that the amount of particles, either dust or dirt, must be maintained at 10,000 per cubic foot. Otherwise, the whole area will be shut down. On the other hand, EOL Clean Room protocol is more lenient than the FOL. EOL operators …show more content…
The inspected wafer will be mounted to wafer mount machines. The wafer will be attached to a metal plate using a tacky tape. Afterwards, the wafer upon being attached to a metal plate will undergo sawing. The wafer will be divided into pieces with a specific measurement provided by the customer. Furthermore, there is a 100% inspection to determine the good die and the bad die. Dies are the segmented part that are later dettached from the wafer. The operator uses a high degree of magnification to properly see the dies. Bad dies are inked or marked to distinguish it from the good die. The good die is attached to a leadframe and into the die paddle by a die bonding machine. Adhesives that can be used are glass, epoxy, or gold preform. The die attached strip will be cured/ baked in a furnace to harden the adhesive. Lastly, the circuitry of the IC is established using copper, palladium, or gold wire. The finsihed wire bonded strip will still be inspected and will undergo Quality Control gate acceptance. If it passed, it will receive the QC acceptance stamp on the Lot Traveller Cars (LTC); if reject, it receives the reject stamp. In summary, the operations included in FOL are Wafer Incoming Inspection, Wafer Mount, Wafer Saw, Second Optical Inspection, Die Attach, Die Attach Cure, Wire bonding and …show more content…
The line starts with the enclosing of the wire bonded dies, since these units are sensitive to movement and other activites. Molding is the process of protecting the circuitry of the IC by encapsulating it with pelletized epoxy molding compound in an automatic or manual molding system. Then, the package strip is cured or baked in a furnace to harden the adhesive for durability. The molded die will also be permanently marked using laser beam. Marking on package includes the device name and device info while bottom markings provide the history assembly of the lot. Lead finish-solder plating is an optional process where the leadframe is subjected to electroplating process with plating materials, lead (Pb) and tin (Sn), to prevent rusting or corrosion and furthe contamination. Trimming, forming and singulation summarizes the last step the strips will undergo. Excess mold flashes are removed and units are seperated individually in these stations. Singulated dies will be placed in a plastic tube that will be inspected to ensure the quality of the product. Finally, the finished units will be packaged in accordance with the customer
The production line is divided into two parts, the Front of Line (FOL) and the End of Line (EOL). Front of line operators need to wear bunny suit as a Clean Room protocol to ensure that the amount of particles, either dust or dirt, must be maintained at 10,000 per cubic foot. Otherwise, the whole area will be shut down. On the other hand, EOL Clean Room protocol is more lenient than the FOL. EOL operators …show more content…
The inspected wafer will be mounted to wafer mount machines. The wafer will be attached to a metal plate using a tacky tape. Afterwards, the wafer upon being attached to a metal plate will undergo sawing. The wafer will be divided into pieces with a specific measurement provided by the customer. Furthermore, there is a 100% inspection to determine the good die and the bad die. Dies are the segmented part that are later dettached from the wafer. The operator uses a high degree of magnification to properly see the dies. Bad dies are inked or marked to distinguish it from the good die. The good die is attached to a leadframe and into the die paddle by a die bonding machine. Adhesives that can be used are glass, epoxy, or gold preform. The die attached strip will be cured/ baked in a furnace to harden the adhesive. Lastly, the circuitry of the IC is established using copper, palladium, or gold wire. The finsihed wire bonded strip will still be inspected and will undergo Quality Control gate acceptance. If it passed, it will receive the QC acceptance stamp on the Lot Traveller Cars (LTC); if reject, it receives the reject stamp. In summary, the operations included in FOL are Wafer Incoming Inspection, Wafer Mount, Wafer Saw, Second Optical Inspection, Die Attach, Die Attach Cure, Wire bonding and …show more content…
The line starts with the enclosing of the wire bonded dies, since these units are sensitive to movement and other activites. Molding is the process of protecting the circuitry of the IC by encapsulating it with pelletized epoxy molding compound in an automatic or manual molding system. Then, the package strip is cured or baked in a furnace to harden the adhesive for durability. The molded die will also be permanently marked using laser beam. Marking on package includes the device name and device info while bottom markings provide the history assembly of the lot. Lead finish-solder plating is an optional process where the leadframe is subjected to electroplating process with plating materials, lead (Pb) and tin (Sn), to prevent rusting or corrosion and furthe contamination. Trimming, forming and singulation summarizes the last step the strips will undergo. Excess mold flashes are removed and units are seperated individually in these stations. Singulated dies will be placed in a plastic tube that will be inspected to ensure the quality of the product. Finally, the finished units will be packaged in accordance with the customer